TES1-7102 Miniature Small Power Semiconductor Refrigeration Chip

1. Chip model: TEC1-7102SR
2. Temperature difference: 65 degrees Celsius
3. Voltage: 8.4V (MAX)
4. Internal resistance value: 3.1-3.6 ohms (ambient temperature 23 degrees Celsius, 1KHZAc test)
5. Assembly pressure: 85N/cm2
6. Working environment: Temperature range -55~83 degrees Celsius (excessive ambient temperature will directly affect the refrigeration efficiency)
7. Current: 2A (MAX)
8. Packaging process: 704 silicone rubber around
9. Storage conditions ambient temperature -10~40 degrees Celsius
10. A radiator or water-cooled heat dissipation device must be installed on the heat dissipation surface, otherwise it will burn.
11. Device characteristics: red line positive electrode, black line negative electrode (literally the refrigeration surface, non-literally the heat dissipation surface)
12. When testing without heat dissipation, there will be a cooling effect. If the power is turned on, the power supply should be unplugged immediately within 1 second, otherwise the refrigeration plate will be easily burned.
13. Note: no matter whether it is water-cooled or air-cooled, thermal silicone grease must be applied
14. Wire specifications: lead length 150mm, RV standard wire single head 5mm tin plated
15. Dimensions: 20x20x3.5mm