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100 pieces of red copper thermal cooling pads are designed for heat dissipation in Android smartphone CPUs. They are suitable for use after chip reballing or motherboard maintenance to prevent overheating.
Material: Oxygen-free pure copper
Dimensions: 12.4mm x 14mm
Thickness: 0.1mm
Available thickness options: 0.1mm, 0.3mm, 0.5mm
Function: Provides targeted heat dissipation
Application: Replaces damaged OEM thermal materials after CPU rework
Prevents short circuits with precision-customized dimensions
Reduces chip temperature when used with thermal paste
SKU:
TBD0606460301
Product Origin:
China
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Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
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