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1. A variety of models to meet the needs of different scenarios of mobile phone repair 2. High rigidity and flexibility 3. Hand-sharpened blades 4. 5 models: Ma1.0: pry to remove the glue from IC and CPU Ma2.0: corner knife scraping IC peripheral glue Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board Ma4.0: prying IC hard disk Ma5.0: prying CPU IC hard disk and CPU layering
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
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