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1. High strength lightweight, precision handling, enhanced control, superior corrosion resistance, adapts to various environments 2. T3D-11 3D Ultra-Stiff Model: Designed for chip reballing and micro-flying wire operations under microscopy 3. Tia-11 Standard Model: Designed for daily electronics repair, phone disassembly, chip replacement, and general tasks 4. Tia-16 45 degrees Curved Tip Model: Angled design for flying wires, handling compact components, and precise adjustments 5. Use: Electronics assembly repair, chip debugging, ESD and contamination protection
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