TES1-4903 Micro Power Temperature Difference Semiconductor Refrigeration Plate

1. Chip model: TES1-4903
2. Temperature difference: 65 degrees Celsius
3. Voltage: 6V (MAX)
4. Recommended voltage: 5V
5. Assembly pressure: 85N/cm2
6. Refrigeration capacity: 9.8W (MAX)
7. Current: 3A (MAX)
8. Working environment: Temperature range -55~83 degrees Celsius (excessive ambient temperature will directly affect the refrigeration efficiency)
9. Packaging process: 704 silicone rubber seal or epoxy resin seal
10. Storage conditions ambient temperature -10~40 degrees Celsius
11. Device characteristics: red line positive electrode, black line negative electrode (literally the refrigeration surface, non-literally the heat dissipation surface)
12. When testing without heat dissipation, there will be a cooling effect. If the power is turned on, the power supply should be unplugged immediately within 1 second, otherwise the refrigeration plate will be easily burned.
13. A radiator or water-cooled heat dissipation device must be installed on the heat dissipation surface, otherwise it will burn.
14. Note: no matter whether it is water-cooled or air-cooled, thermal silicone grease must be applied
15. Single weight: 7g
16. Wire specification: lead length 30-150mm
17. Dimensions: 20x20x3.7mm