1
/
of
6
No reviews
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
SKU: SPT0031
Regular price
R 580.00
Regular price
Sale price
R 580.00
Duties & Import Tax Information
Duties are only included if shown at checkout. Otherwise, your local government may apply customs fees, which your courier will collect directly from you before delivery.
In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
Quantity
Couldn't load pickup availability
Shipping info
To find all available shipping methods and exact delivery times, add the product to your cart and check using our shipping calculator.
30-day returns
Fast refunds: Once we receive and check your item, we aim to process your refund within 48 hours.
Return postage: Just changed your mind? You'll need to cover the return postage. If the item arrived faulty, we'll cover the cost to get it back to us.
Your details are safe
We treat your data the way we'd want ours treated. Your payment details are locked down with bank-level encryption. We never actually see your credit card numbers, and we will absolutely never sell your personal information.
Product Details
Type:
Repair Platform
1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Share
R 580.00