1
/
de
8
No reviews
Mijing Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform For iPhone 11-17 Pro Max / Android
Mijing Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform For iPhone 11-17 Pro Max / Android
SKU: EDA0093481
Prix habituel
£30.59
Prix habituel
Prix promotionnel
£30.59
Frais d'expédition calculés à l'étape de paiement.
Duties & Import Tax Information
Duties are only included if shown at checkout. Otherwise, your local government may apply customs fees, which your courier will collect directly from you before delivery.
In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
Quantité
Impossible de charger la disponibilité du service de retrait
Shipping info
To find all available shipping methods and exact delivery times, add the product to your cart and check using our shipping calculator.
30-day returns
Fast refunds: Once we receive and check your item, we aim to process your refund within 48 hours.
Return postage: Just changed your mind? You'll need to cover the return postage. If the item arrived faulty, we'll cover the cost to get it back to us.
Your details are safe
We treat your data the way we'd want ours treated. Your payment details are locked down with bank-level encryption. We never actually see your credit card numbers, and we will absolutely never sell your personal information.
1. Equipped with a powerful magnetic system that ensures automatic alignment and stable fixation of CPU chips, improving reballing accuracy while minimizing operational errors.
2. Integrates both tin planting (reballing) and adhesive removal in one platform, enabling multiple repair processes with a single tool and significantly enhancing work efficiency.
3. Engineered with precise positioning and limit structures to ensure perfect alignment between stencil and chip, delivering consistent and uniform solder ball formation.
4. Compatible with iPhone 11–17 series CPUs as well as various Android chipsets (Qualcomm, MediaTek, etc.), offering broad application coverage.
5. Built with high-strength, heat-resistant materials that resist deformation, ensuring stability and reliability during prolonged, high-temperature operations.
2. Integrates both tin planting (reballing) and adhesive removal in one platform, enabling multiple repair processes with a single tool and significantly enhancing work efficiency.
3. Engineered with precise positioning and limit structures to ensure perfect alignment between stencil and chip, delivering consistent and uniform solder ball formation.
4. Compatible with iPhone 11–17 series CPUs as well as various Android chipsets (Qualcomm, MediaTek, etc.), offering broad application coverage.
5. Built with high-strength, heat-resistant materials that resist deformation, ensuring stability and reliability during prolonged, high-temperature operations.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Partager
£30.59