1
/
de
8
No reviews
Qianli 4 in 1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 Series
Qianli 4 in 1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 Series
SKU: EDA0076119
Prix habituel
£49.77
Prix habituel
Prix promotionnel
£49.77
Frais d'expédition calculés à l'étape de paiement.
In Stock
CHN
This item is shipped from China.
Ships in 0–3 days
Quantité
Impossible de charger la disponibilité du service de retrait
1-Year Warranty
What's covered?
If your item develops a hardware fault or manufacturing defect, we've got you covered.
How we help
Our tech team is ready to test, repair, or replace your item to get you sorted as quickly as possible.
30-day returns
Fast refunds
Once we receive and check your item, we aim to process your refund within 48 hours.
Return postage
Just changed your mind? You'll need to cover the return postage. If the item arrived faulty, we'll cover the cost to get it back to us.
Your details are safe
We treat your data the way we'd want ours treated. Your payment details are locked down with bank-level encryption. We never actually see your credit card numbers, and we will absolutely never sell your personal information.
Trusted by DIY & repair professionals in 40+ countries
1. 4 in 1 Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 16/16 Plus/16 Pro/16 Pro Max
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature
7. Avoiding SIM card base not being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, manufactured under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
9. Square chamfer mesh, prevents the tin balls from being stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x Stencil
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature
7. Avoiding SIM card base not being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, manufactured under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
9. Square chamfer mesh, prevents the tin balls from being stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x Stencil
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Partager

£49.77