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QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat
QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat
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1. Working frequency: high frequency
2. Application range: integrated circuit IC
3. Production process: injection molding
4. Contact material: beryllium copper shrapnel
5. Insulator material: PPS PET
6. Number of cores: 32
7. Name: QFN32 flip shrapnel to 152 test seat
8. Purpose: programming socket and test socket, to program and test QFN32 IC chips
9. Chip size: 5x5cm
10. Pin spacing: 0.5mm
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